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Home arrow Korean Studies arrow Language Scholarships arrow 2008-2009 Korean Language Study Awards
 
2008-2009 Korean Language Study Awards Print E-mail
Application Deadline: April 1, 2008
Each year, The Korea Society accepts applications for its language scholarships which support Korean language study at a university in Korea. The benefits of the scholarship include tuition, round-trip airfare to Korea and a stipend to cover basic living expenses.

Eligibility
- Graduate students enrolled in degree programs, recent college graduates or young professionals with a clearly defined interest in Korea
- U.S. citizens or permanent residents who are currently residing in the United States

Benefits
- Tuition and fees
- Economy class round-trip airfare between the recipient’s home of record and Seoul by the most direct route
- Modest stipend to cover living costs during the period of the award

Terms and Conditions
- The award is granted for study at a university in Korea.
- Application and acceptance to a university is the responsibility of the recipient.
- Award recipients must reside in Korea during the entire period of study.
- No other academic or commercial activity may be undertaken during the period of awarded language-study.
- All award recipients are required to submit a brief written report within 30 days of the completion of their program of study. The recipient of the academic year study award must also submit an interim report.
- Any other financial assistance received for the period of the study award must be reported immediately for possible adjustment of award benefits.

Application
- Two language scholarships will be awarded, one for the summer term and one for the academic year. Individuals may apply for only one of the two scholarships offered.
- Applicants must submit: application form (see link below); resume; official college transcripts; and two letters of reference.
- The application postmark deadline is April1, 2008, for the 2008–2009 awards.

click here (pdf 68.5Kb) to download the application.

 

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